Smart Power IC Technology: Status, Challenges and Future Trends

Dr. Ronghua Zhu
Friday, May 19, 2006
10:30AM ~ 11:30AM - ENGR-427

Abstract


Smart Power Technologies integrate high-speed logic, precision analog and high voltage power devices in one single technology platform to provide system-onchip solutions. It is widely used in automotive, commercial and consumer applications. This presentation will provide an overview of smart power technology current status and challenges facing the industry. The topics include system integration issues and technology platform, device cross talks and parasitic latchup, high voltage power device design, power device energy capability, metal debiasing effects, and device mismatch issues. At the end, the future trends of smart power technology development will also be discussed.

Short Bio


Dr. Ronghua Zhu received his PhD from Rensselaer Polytechnic Institute in 1998. He has been with Freescale Semiconductor (formerly Motorola Semiconductor Product Sector),Mesa, Arizona since 1996. He was one of the key technical contributors responsible for several generations of smart power IC technology. He has published 29 journal and conference paper and holds 10 issued patents with additional 18 patent applications pending. He is currently a distinguished member of technical staff at Freescale Semiconductor, Inc. and recipient of distinguished innovator award from the company. He is also a member of technical committee for International Symposium on Power Semiconductor Device and ICs

Contact: Ravi Todi; rtodi@mail.ucf.edu; 407-823-4476