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MEMS based SAW Devices for Wireless Sensing

Dr. Jan H. Kuypers
Friday, January 11, 2008
11:00AM ~ 12:30PM, Harris Center 101

Abstract


The talk will give an overview of the impact of microelectromechanical systems (MEMS) technologies on wireless SAW sensors and tunable SAW devices. It will briefly discuss the simulation and design of SAW delay line sensors, the application to wireless temperature and strain measurement, and wafer level packaging techniques. The last part of the talk is dedicated to recent results on controlling the phase velocity of SAWs using an electrostatic MEMS structure and the application to acoustic phase shifters and passive transponders.

Short Bio


Jan H. Kuypers (M'05) received the Dipl.-Ing. degree from the Department of Microsystem Technology IMTEK at the University of Freiburg, Germany in 2004, and the Ph.D. degree in Nanomechanics from Tohoku University, Japan in 2007. He is currently employed as a research specialist by the Berkeley Sensor and Actuator Center (BSAC) at the University of California at Berkeley. He has been working on the evaluation of mechanical properties of MEMS thin films, deposition of aluminum nitride thin films, FBAR, SMR, modeling of SAW devices, wireless SAW sensors, MEMS based SAW devices, and wafer level packaging. He is the author of the K-model, a higher order Green's function based simulation model for SAW devices. He was awarded the best Student Paper at the IEEE Ultrasonics Symposium 2007. He is member of the IEEE, Ultrasonics, Ferroelectrics, and Frequency Control (UFFC) society and the Microwave Theory and Techniques society. Since 2007 he is a member of the technical program committee of the UFFC.

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