Flip-Chip for Millimeter-Wave Packaging

IEEE MTT/AP Orlando Chapter Meeting

DATE/TIME: Wednesday, November 14, 2007, 4:00 PM
SPEAKER:      Dr. Wolfgang Heinrich
Ferdinand-Braun Institut (FBH),  Microwave Department
LOCATION:      HEC 101

ABSTRACT:

Emerging markets for mm-wave systems demand for cost-effective packaging solutions. Flip-chip is one of the most promising approaches in this regard. The talk presents basic features as well as design guidelines and recent results demonstrating the potential of flip-chip for mm-wave and broadband multi-chip modules and packaging.

BIOGRAPHY:

Dr. Wolfgang Heinrich received the Dipl.-Ing., Dr.-Ing. and habilitation degrees in 1982, 1987, and 1992, respectively, all from the Technical University of Darmstadt, Germany. Since 1993, he has been with the Ferdinand-Braun-Institut (FBH) at Berlin, Germany, where he is head of the microwave department and deputy director of the institute. His present research activities focus on MMIC design with emphasis on oscillators, GaAs and GaN power transistors, electromagnetic simulation and mm-wave packaging.

Dr. Heinrich has authored or coauthored more than 200 publications and conference contributions. He served as Distinguished Microwave Lecturer for the term 2003/2005. Since 2002, he has been chairman of the German IEEE MTT/AP chapter.

Bring a guest. Non-Members Welcome! Refreshments will be provided.